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Department Arzt – Facilities
1. Testing of Small-Scale Materials |
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Measurement of stresses and stress relaxation in thin films by laser-optical measurement of substrate curvature, as a function of temperature and in various atmospheres |
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X-ray stress measurement in thin films and narrow lines, as a function of temperature |
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Depth-sensing indentation ("nanoindentation") measurements coupled with atomic force microscopy for nm-scale contacts |
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Micro-tensile testing machine for determining stress-strain curves of thin films on substrates, with X-ray stress measurement and laser-optical strain measurement |
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Damping mesurements of micro-beams |
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Electromigration test stations, also in situ in the SEM for direct observation, and with high-resolution resistance measurement |
2. Mechanical Testing of Biomaterials |
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Microforce tester for measurements of adhesion, friction, and microindentation of biological and non-biological samples |
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Centrifugal force tester for measurement of friction and adhesion of small-scale living animals |
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Load cell force transducer coupled with a motorized micromanipulator for measurements of adhesive forces and traction force of living animals |
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Contact angle measurement device |
3. Testing of Structural Alloys |
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Creep, high-temperature fatigue and thermomechanical fatigue tests at temperatures up to 1400 °C |
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Crack growth measurements, also in situ in an SEM |
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Acoustic emission testing with multichannel recording system for quantitative analysis |
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Ultrasonic testing: measurement of velocity and attenuation of stress waves with various pulse-echo-overlap and continuous-wave methods |
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Measurements of dielectric loss and AC and DC electrical conductivity |
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Mechanical loss measurements in the temperature range 4 to 1400K with a low-frequency forced-vibration apparatus, an inverted torsion pendulum, and a kHz resonant bar apparatus |
4. Microstructural Investigations |
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Scanning Electron Microscope with an in-situ 4-point bending stage and an electromigration test station for direct observation |
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Focused Ion Beam Workstation for imaging and machining of small-scale materials |
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X-ray diffractometer with heating stage and position-sensitive detector, for phase analysis and stress measurements |
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Four-circle X-ray diffractometer for texture measurements |
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In situ HVTEM observation of thin films during temperature cycles and under stresses |
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Bright field and fluorescent microscopy |
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High-speed videocamera (50-10000 fps) |
5. Material Synthesis |
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UHV sputter and evaporation systems for thin-film preparation |
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Electron beam lithography for thin film patterning |
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Local Deposition and Removal by focused ion beam methods |
1. Testing of
Small-Scale Materials
3. Testing of
Structural Alloys
4. Microstructural Investigations